{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9622347","patent":{"patent_number":"US-9622347","title":"Wiring substrate, semiconductor device, method of manufacturing wiring substrate, and method of manufacturing semiconductor device","assignee":null,"inventors":[],"filing_date":"2014-12-05T00:00:00.000Z","publication_date":"2017-04-11T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":4,"abstract":"A wiring substrate includes a first multi-layer wiring layer having a stacked via structure including a first electrode pad, a second multi-layer wiring layer having a non-stacked via structure including a second electrode pad. The second electrode pad is formed on an uppermost first insulating layer. The first electrode pad is formed on a second insulating layer which is located to a position lower by one layer than the first insulating layer, and the first electrode pad is arranged in an opening portion of the first insulating layer such that the upper face and the side face of the first electrode pad are exposed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring substrate, semiconductor device, method of manufacturing wiring substrate, and method of manufacturing semiconductor device","description":"A wiring substrate includes a first multi-layer wiring layer having a stacked via structure including a first electrode pad, a second multi-layer wiring layer having a non-stacked via structure includ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9622347","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9622347","citation_suggestion":"Patentable. \"Wiring substrate, semiconductor device, method of manufacturing wiring substrate, and method of manufacturing semiconductor device\" (US-9622347). https://patentable.app/patents/US-9622347","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9622347","json":"https://patentable.app/api/llm-context/US-9622347","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T16:53:18.785Z"}