{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9624369","patent":{"patent_number":"US-9624369","title":"Liquid resin composition, cured product, wiring structure, and package using wiring structure","assignee":null,"inventors":[],"filing_date":"2015-03-24T00:00:00.000Z","publication_date":"2017-04-18T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":11,"abstract":"A liquid resin composition includes a liquid epoxy resin, a liquid curing agent, a curing accelerator and a ceramic filler. The liquid epoxy resin contains a first epoxy resin having a polyalkylene glycol framework. The liquid curing agent has a plurality of phenolic hydroxy groups per molecule. A content of the first epoxy resin in the liquid epoxy resin is in a range from 30% to 70% by mass, inclusive. The ceramic filler has an average particle diameter of 50 μm or less, and a content of the ceramic filler in the liquid resin composition is in a range from 50% to 90% by mass, inclusive. The liquid resin composition has a viscosity of 100 Pa·s or less at 25° C."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Liquid resin composition, cured product, wiring structure, and package using wiring structure","description":"A liquid resin composition includes a liquid epoxy resin, a liquid curing agent, a curing accelerator and a ceramic filler. The liquid epoxy resin contains a first epoxy resin having a polyalkylene gl","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9624369","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9624369","citation_suggestion":"Patentable. \"Liquid resin composition, cured product, wiring structure, and package using wiring structure\" (US-9624369). https://patentable.app/patents/US-9624369","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9624369","json":"https://patentable.app/api/llm-context/US-9624369","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:40:50.837Z"}