{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9625823","patent":{"patent_number":"US-9625823","title":"Calculation method for local film stress measurements using local film thickness values","assignee":null,"inventors":[],"filing_date":"2011-04-27T00:00:00.000Z","publication_date":"2017-04-18T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":19,"abstract":"A system and method for local film stress calculation is disclosed. The method may include specifying a plurality of measurement points on a substrate, the substrate being configured to receive a film deposition; obtaining a local film thickness measurement for each measurement point; obtaining a local wafer shape parameter for each measurement point; and calculating a local film stress value for each measurement point based on the local film thickness measurement and the local wafer shape parameter for each corresponding measurement point. The method may further include specifying a plurality of estimation points on the substrate; obtaining a local wafer shape parameter for each estimation point; calculating an estimated local film thickness for each estimation point; and calculating a local film stress value for each estimation point based on the estimated local film thickness and the local wafer shape parameter for each corresponding estimation point."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Calculation method for local film stress measurements using local film thickness values","description":"A system and method for local film stress calculation is disclosed. The method may include specifying a plurality of measurement points on a substrate, the substrate being configured to receive a film","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9625823","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9625823","citation_suggestion":"Patentable. \"Calculation method for local film stress measurements using local film thickness values\" (US-9625823). https://patentable.app/patents/US-9625823","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9625823","json":"https://patentable.app/api/llm-context/US-9625823","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:33:56.539Z"}