{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9627215","patent":{"patent_number":"US-9627215","title":"Structure and method for interconnection","assignee":null,"inventors":[],"filing_date":"2015-09-25T00:00:00.000Z","publication_date":"2017-04-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method includes providing a substrate having a first conductive feature in a first dielectric material layer; forming a first etch stop layer on the first dielectric material layer, wherein the first etch stop layer is formed of a high-k dielectric material; forming a second etch stop layer on the first etch stop layer; forming a second dielectric material layer on the second etch stop layer; forming a pattered mask layer on the second dielectric material layer; forming a first trench in the second dielectric material layer and the second etch stop layer; removing a portion of the first etch stop layer through the first trench to thereby form a second trench, wherein removing the portion of the first etch stop layer includes applying a solution to the portion of the first etch stop layer; and forming a second conductive feature in the second trench."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Structure and method for interconnection","description":"A method includes providing a substrate having a first conductive feature in a first dielectric material layer; forming a first etch stop layer on the first dielectric material layer, wherein the firs","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9627215","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9627215","citation_suggestion":"Patentable. \"Structure and method for interconnection\" (US-9627215). https://patentable.app/patents/US-9627215","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9627215","json":"https://patentable.app/api/llm-context/US-9627215","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:42:19.471Z"}