{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9627260","patent":{"patent_number":"US-9627260","title":"Workpiece cutting method using dummy wafer to determine condition of cutting blade","assignee":null,"inventors":[],"filing_date":"2016-03-22T00:00:00.000Z","publication_date":"2017-04-18T00:00:00.000Z","cpc_codes":["H01L","B23Q","B23Q","B23Q","H01L","H01L","H01L","H01L"],"num_claims":3,"abstract":"A workpiece cutting method of cutting a workpiece having a front side on which a plurality of crossing division lines are formed to define a plurality of separate regions where a plurality of devices are each formed is disclosed. The workpiece cutting method includes a workpiece cutting step of cutting the workpiece held on a first chuck table along the division lines by using a cutting blade, a dummy wafer cutting step of cutting a dummy wafer held on a second chuck table by using the cutting blade, a dummy wafer imaging step of imaging a cut groove formed on the dummy wafer in the dummy wafer cutting step, by using an imaging unit to thereby obtain a detected image, and a determining step of determining the condition of the cutting blade from the condition of chippings formed on both sides of the cut groove in the detected image."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Workpiece cutting method using dummy wafer to determine condition of cutting blade","description":"A workpiece cutting method of cutting a workpiece having a front side on which a plurality of crossing division lines are formed to define a plurality of separate regions where a plurality of devices ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9627260","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9627260","citation_suggestion":"Patentable. \"Workpiece cutting method using dummy wafer to determine condition of cutting blade\" (US-9627260). https://patentable.app/patents/US-9627260","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9627260","json":"https://patentable.app/api/llm-context/US-9627260","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:44:27.264Z"}