{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9627290","patent":{"patent_number":"US-9627290","title":"Bump structure design for stress reduction","assignee":null,"inventors":[],"filing_date":"2011-12-07T00:00:00.000Z","publication_date":"2017-04-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Low stress bumps can be used to reduce stress and strain on bumps bonded to a substrate with different coefficients of thermal expansion (CTEs) from the die. The low stress bumps include multiple polymer layers. More than one type of bump is coupled to a die, with low stress bumps placed on areas subjected to high stress."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Bump structure design for stress reduction","description":"Low stress bumps can be used to reduce stress and strain on bumps bonded to a substrate with different coefficients of thermal expansion (CTEs) from the die. The low stress bumps include multiple poly","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9627290","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9627290","citation_suggestion":"Patentable. \"Bump structure design for stress reduction\" (US-9627290). https://patentable.app/patents/US-9627290","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9627290","json":"https://patentable.app/api/llm-context/US-9627290","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:18:56.991Z"}