{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9627293","patent":{"patent_number":"US-9627293","title":"Semiconductor device and heat-conductive sheet","assignee":null,"inventors":[],"filing_date":"2015-04-24T00:00:00.000Z","publication_date":"2017-04-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"In a conventional semiconductor device, a pattern serving as a heat dissipating material is formed by applying a phase transition material. Provided is a semiconductor device that can reduce collapse of a pattern shape even if a shock is applied to the pattern formed with the phase transition material that is liquefied when the environmental temperature is not sufficiently controlled. The semiconductor device includes semiconductor elements mounted inside a semiconductor module (10); a heat radiating surface (13), formed in the semiconductor module (10), dissipating heat generated in the semiconductor elements to a heat radiator; a pattern (14) formed on the heat radiating surface and made from a phase transition material; and a film (15) serving as a first film that covers the pattern (14)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and heat-conductive sheet","description":"In a conventional semiconductor device, a pattern serving as a heat dissipating material is formed by applying a phase transition material. Provided is a semiconductor device that can reduce collapse ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9627293","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9627293","citation_suggestion":"Patentable. \"Semiconductor device and heat-conductive sheet\" (US-9627293). https://patentable.app/patents/US-9627293","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9627293","json":"https://patentable.app/api/llm-context/US-9627293","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:03:14.165Z"}