{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9627297","patent":{"patent_number":"US-9627297","title":"Solder flow-impeding plug on a lead frame","assignee":null,"inventors":[],"filing_date":"2015-10-30T00:00:00.000Z","publication_date":"2017-04-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"Embodiments described herein relate to a packaged component including a lead frame and a non-conductive plug disposed between two or more adjacent sections of the lead frame. The plug is composed of a non-conductive material functions to impede the flow of solder along edges of the two or more adjacent sections during second level solder reflow events that occur after encapsulation of the packaged component. The plug includes a main portion disposed within a space between the two or more adjacent sections, and one or more overlap portions extending from the main portion. The one or more overlap portions are disposed on an internal surface of at least one of the two or more adjacent sections. At least one component is mounted on one of the plurality of sections of the lead frame."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Solder flow-impeding plug on a lead frame","description":"Embodiments described herein relate to a packaged component including a lead frame and a non-conductive plug disposed between two or more adjacent sections of the lead frame. The plug is composed of a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9627297","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9627297","citation_suggestion":"Patentable. \"Solder flow-impeding plug on a lead frame\" (US-9627297). https://patentable.app/patents/US-9627297","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9627297","json":"https://patentable.app/api/llm-context/US-9627297","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:38:59.299Z"}