{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9627299","patent":{"patent_number":"US-9627299","title":"Structure and method for diminishing delamination of packaged semiconductor devices","assignee":null,"inventors":[],"filing_date":"2016-02-11T00:00:00.000Z","publication_date":"2017-04-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor device (100) comprising a leadframe with a pad (101) and elongated leads (103) made of a base metal plated with a layer enabling metal-to-metal bonding; a semiconductor chip (110) attached to the pad, the chip having terminals. A metallic wire connection (130) from a terminal to a respective lead, the connection including a first ball bond by a first squashed ball (131) attached to the terminal, and a first stitch bond (132) attached to the lead. A second squashed ball (150) of the wire metal attached to the lead as a second ball bond adjacent to the first stitch bond (132). A package (170) of a polymeric compound encapsulating the chip, wire connection, second ball and at least a portion of the elongated lead, the compound adhering to the materials of the encapsulated entities."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Structure and method for diminishing delamination of packaged semiconductor devices","description":"A semiconductor device (100) comprising a leadframe with a pad (101) and elongated leads (103) made of a base metal plated with a layer enabling metal-to-metal bonding; a semiconductor chip (110) atta","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9627299","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9627299","citation_suggestion":"Patentable. \"Structure and method for diminishing delamination of packaged semiconductor devices\" (US-9627299). https://patentable.app/patents/US-9627299","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9627299","json":"https://patentable.app/api/llm-context/US-9627299","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:01:35.103Z"}