{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9627303","patent":{"patent_number":"US-9627303","title":"Etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with chip, and technological method","assignee":null,"inventors":[],"filing_date":"2013-12-02T00:00:00.000Z","publication_date":"2017-04-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Provided is an etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with a chip. The structure comprises a metal substrate frame, wherein a base island and pins are arranged in the metal substrate frame; a chip is inversely arranged on a front face of the base island and the pins; a conductive pillar is arranged on a front face of the pins; the region on the periphery of the base island, the region between the base island and the pins, the region between one pin and another, the region above the base island and the pins, the region below the base island and the pins, and the outside of the chip and the conductive pillar are all enveloped with a plastic packaging material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with chip, and technological method","description":"Provided is an etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with a chip. The structure comprises a metal substrate frame, wherein a base isl","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9627303","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9627303","citation_suggestion":"Patentable. \"Etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with chip, and technological method\" (US-9627303). https://patentable.app/patents/US-9627303","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9627303","json":"https://patentable.app/api/llm-context/US-9627303","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:43:08.246Z"}