{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9627309","patent":{"patent_number":"US-9627309","title":"Wiring substrate","assignee":null,"inventors":[],"filing_date":"2016-04-26T00:00:00.000Z","publication_date":"2017-04-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"A wiring substrate includes a first wiring substrate, a first insulation layer stacked on the first wiring layer, and second and third insulation layers sequentially stacked on the first insulation layer. An electronic component is mounted on the first insulation layer in a cavity extending through the second and third insulation layers. The cavity is filled with a fourth insulation layer that entirely covers an upper surface of the third insulation layer and covers the electronic component. A second wiring layer is incorporated in the second and third insulation layers and electrically connected to the first wiring layer. The second wiring layer is electrically connected to a third wiring layer, which is stacked on the fourth insulation layer, by a first via wiring extending through the second and third insulation layers."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring substrate","description":"A wiring substrate includes a first wiring substrate, a first insulation layer stacked on the first wiring layer, and second and third insulation layers sequentially stacked on the first insulation la","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9627309","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9627309","citation_suggestion":"Patentable. \"Wiring substrate\" (US-9627309). https://patentable.app/patents/US-9627309","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9627309","json":"https://patentable.app/api/llm-context/US-9627309","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T14:40:39.343Z"}