{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9627311","patent":{"patent_number":"US-9627311","title":"Chip package, package substrate and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2015-01-22T00:00:00.000Z","publication_date":"2017-04-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A package substrate is provided. The package substrate includes: a dielectric layer; a passive component embedded in the dielectric layer and contacting the dielectric layer; and a circuit layer embedded in the dielectric layer and having a first surface aligned with a second surface of the dielectric layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip package, package substrate and manufacturing method thereof","description":"A package substrate is provided. The package substrate includes: a dielectric layer; a passive component embedded in the dielectric layer and contacting the dielectric layer; and a circuit layer embed","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9627311","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9627311","citation_suggestion":"Patentable. \"Chip package, package substrate and manufacturing method thereof\" (US-9627311). https://patentable.app/patents/US-9627311","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9627311","json":"https://patentable.app/api/llm-context/US-9627311","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:19:06.127Z"}