{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9627315","patent":{"patent_number":"US-9627315","title":"Semiconductor device having a multi-level interconnection structure","assignee":null,"inventors":[],"filing_date":"2015-07-30T00:00:00.000Z","publication_date":"2017-04-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A semiconductor device includes a semiconductor substrate, and a multi-level interconnection structure that is provided on the semiconductor substrate and that has a plurality of interconnection layers stacked one on another. Each interconnection layer includes a real interconnection and a dummy interconnection covered with an insulative film. The interconnection layers include a first interconnection layer including a first real interconnection, a second interconnection layer stacked on the first interconnection layer and including an overlapping dummy interconnection that overlaps the first real interconnection in a stacking direction of the plurality of interconnection layers in a sectional view, and a third interconnection layer stacked on the second interconnection layer and including a second real interconnection that overlaps the overlapping dummy interconnection in the stacking direction of the plurality of interconnection layers in the sectional view."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device having a multi-level interconnection structure","description":"A semiconductor device includes a semiconductor substrate, and a multi-level interconnection structure that is provided on the semiconductor substrate and that has a plurality of interconnection layer","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9627315","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9627315","citation_suggestion":"Patentable. \"Semiconductor device having a multi-level interconnection structure\" (US-9627315). https://patentable.app/patents/US-9627315","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9627315","json":"https://patentable.app/api/llm-context/US-9627315","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:04:18.315Z"}