{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9627318","patent":{"patent_number":"US-9627318","title":"Interconnect structure with footing region","assignee":null,"inventors":[],"filing_date":"2014-06-16T00:00:00.000Z","publication_date":"2017-04-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"In some embodiments, an interconnect structure includes a base layer, a plurality of dielectric layers and a conductive structure. The base layer includes a conductive region. The plurality of dielectric layers are formed over the base layer. The plurality of dielectric layers includes a first dielectric layer and an etch stop layer under the first dielectric layer. The conductive structure includes a plug. The plug includes a central region and one or more footing regions. The footing regions are formed around the central region and formed at least partially in the first etch stop layer. A total width of the central region and one or more footing regions at a bottom level of the plurality of dielectric layers is at least about 5% more than a width of the central region at the bottom level of the plurality of dielectric layers."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interconnect structure with footing region","description":"In some embodiments, an interconnect structure includes a base layer, a plurality of dielectric layers and a conductive structure. The base layer includes a conductive region. The plurality of dielect","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9627318","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9627318","citation_suggestion":"Patentable. \"Interconnect structure with footing region\" (US-9627318). https://patentable.app/patents/US-9627318","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9627318","json":"https://patentable.app/api/llm-context/US-9627318","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:19:54.210Z"}