{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9627325","patent":{"patent_number":"US-9627325","title":"Package alignment structure and method of forming same","assignee":null,"inventors":[],"filing_date":"2013-03-06T00:00:00.000Z","publication_date":"2017-04-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"An embodiment is a semiconductor device comprising a first bond pad on a first substrate, the first bond pad having a first center line through a center of the first bond pad and orthogonal to a top surface of the first substrate, and a first conductive connector on a second substrate, the first conductive connector having a second center line through a center of the first conductive connector and orthogonal to a top surface of the second substrate, the second substrate over the first substrate with the top surface of the first substrate facing the top surface of the second substrate. The semiconductor device further comprises a first alignment component adjacent the first bond pad on the first substrate, the first alignment component configured to align the first center line with the second center line."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package alignment structure and method of forming same","description":"An embodiment is a semiconductor device comprising a first bond pad on a first substrate, the first bond pad having a first center line through a center of the first bond pad and orthogonal to a top s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9627325","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9627325","citation_suggestion":"Patentable. \"Package alignment structure and method of forming same\" (US-9627325). https://patentable.app/patents/US-9627325","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9627325","json":"https://patentable.app/api/llm-context/US-9627325","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:48:37.267Z"}