{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9627339","patent":{"patent_number":"US-9627339","title":"Method of forming an integrated circuit device including a pillar capped by barrier layer","assignee":null,"inventors":[],"filing_date":"2015-09-03T00:00:00.000Z","publication_date":"2017-04-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of forming an integrated circuit device includes forming a mask layer overlying an under bump metallurgy (UBM) layer, wherein the mask layer comprises a first portion adjacent to the UBM layer, and a second portion overlying the first portion. The method further includes forming an opening in the mask layer to expose a portion of the UBM layer. The method further includes forming a conductive layer in the opening of the mask layer, electrically connected to the exposed portion of the UBM layer. The method further includes removing the second portion of the mask layer to expose an upper portion of the conductive layer. The method further includes forming a barrier layer on the exposed upper portion of the conductive layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of forming an integrated circuit device including a pillar capped by barrier layer","description":"A method of forming an integrated circuit device includes forming a mask layer overlying an under bump metallurgy (UBM) layer, wherein the mask layer comprises a first portion adjacent to the UBM laye","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9627339","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9627339","citation_suggestion":"Patentable. \"Method of forming an integrated circuit device including a pillar capped by barrier layer\" (US-9627339). https://patentable.app/patents/US-9627339","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9627339","json":"https://patentable.app/api/llm-context/US-9627339","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T18:29:37.379Z"}