{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9627345","patent":{"patent_number":"US-9627345","title":"Semiconductor-mounted product and method of producing the same","assignee":null,"inventors":[],"filing_date":"2015-07-09T00:00:00.000Z","publication_date":"2017-04-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A semiconductor-mounted product includes a semiconductor package, a circuit board, a solder bonding part, and a resin reinforcing part. Wiring is formed on the surface of the circuit board, and the semiconductor package is mounted on the circuit board. The solder bonding part electrically connects the semiconductor package with the wiring. The resin reinforcing part is formed on a side surface of the solder bonding part such that the solder bonding part is partially exposed. The bonding part has a first solder region formed closer to the semiconductor package than the circuit board, and a second solder region formed closer to the circuit board than the semiconductor package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor-mounted product and method of producing the same","description":"A semiconductor-mounted product includes a semiconductor package, a circuit board, a solder bonding part, and a resin reinforcing part. Wiring is formed on the surface of the circuit board, and the se","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9627345","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9627345","citation_suggestion":"Patentable. \"Semiconductor-mounted product and method of producing the same\" (US-9627345). https://patentable.app/patents/US-9627345","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9627345","json":"https://patentable.app/api/llm-context/US-9627345","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:16:34.571Z"}