{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9627366","patent":{"patent_number":"US-9627366","title":"Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another","assignee":null,"inventors":[],"filing_date":"2014-10-31T00:00:00.000Z","publication_date":"2017-04-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":5,"abstract":"A microelectronic semiconductor package includes first and second microelectronic elements and a substrate positioned between them. Each of the microelectronic elements has active and passive surfaces, first edges bounding the surfaces in a first lateral direction and second edges bounding the surfaces in a second lateral direction transverse to the first lateral direction. The first microelectronic overlies the second microelectronic element and the active surface of the first microelectronic element faces toward the passive surface of the second microelectronic element. Each of the first edges of the first microelectronic element are disposed beyond each of the adjacent first edges of the second microelectronic element. Each of the second edges of the second microelectronic element are disposed beyond each of adjacent second edges of the first microelectronic element."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another","description":"A microelectronic semiconductor package includes first and second microelectronic elements and a substrate positioned between them. Each of the microelectronic elements has active and passive surfaces","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9627366","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9627366","citation_suggestion":"Patentable. \"Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another\" (US-9627366). https://patentable.app/patents/US-9627366","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9627366","json":"https://patentable.app/api/llm-context/US-9627366","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:51:42.119Z"}