{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9629243","patent":{"patent_number":"US-9629243","title":"Electronic component-embedded module","assignee":null,"inventors":[],"filing_date":"2014-07-17T00:00:00.000Z","publication_date":"2017-04-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":21,"abstract":"An electronic component-embedded module mountable on a motherboard has a multilayer board wherein a cavity is formed in order to place an electronic component. The multilayer board includes a board-side resin layer with external electrodes for mounting onto the motherboard and board-side via-conductors connected thereto, an intermediate resin layer with intermediate via-conductors connected to the board-side via-conductors, and a component-side resin layer stacked on the intermediate resin layer and having component-side via-conductors. The component-side via-conductors include first component-side via-conductors connected to the intermediate via-conductors and second component-side via-conductors bonded to the electronic component and connected to the first component-side via-conductors. An intermediate volume ratio obtained by dividing a total volume of the intermediate via-conductors by a volume of the intermediate resin layer is less than a component-side volume ratio obtained by dividing a total volume of the component-side via-conductors by a volume of the component-side resin layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic component-embedded module","description":"An electronic component-embedded module mountable on a motherboard has a multilayer board wherein a cavity is formed in order to place an electronic component. The multilayer board includes a board-si","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9629243","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9629243","citation_suggestion":"Patentable. \"Electronic component-embedded module\" (US-9629243). https://patentable.app/patents/US-9629243","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9629243","json":"https://patentable.app/api/llm-context/US-9629243","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:36:42.422Z"}