{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9630834","patent":{"patent_number":"US-9630834","title":"Wafer scale monolithic CMOS-integration of free- and non-free-standing Metal- and Metal alloy-based MEMS structures in a sealed cavity","assignee":null,"inventors":[],"filing_date":"2014-06-16T00:00:00.000Z","publication_date":"2017-04-25T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":16,"abstract":"An assembly of metallic MEMS structures directly fabricated on planarized CMOS substrates, containing the application-specific integrated circuit (ASIC), by direct deposition and subsequent microfabrication steps on the ASIC interconnect layers, with integrated capping for packaging, is provided. The MEMS structures comprise at least one MEMS device element, with or without moveable parts anchored on the CMOS ASIC wafer with electrical contact provided via the metallic interconnects of the ASIC. The MEMS structures can also be made of metallic alloys, conductive oxides and amorphous semiconductors. The integrated capping, which provides a sealed cavity, is accomplished through bonding pads defined in the post-processing of the CMOS substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer scale monolithic CMOS-integration of free- and non-free-standing Metal- and Metal alloy-based MEMS structures in a sealed cavity","description":"An assembly of metallic MEMS structures directly fabricated on planarized CMOS substrates, containing the application-specific integrated circuit (ASIC), by direct deposition and subsequent microfabri","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9630834","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9630834","citation_suggestion":"Patentable. \"Wafer scale monolithic CMOS-integration of free- and non-free-standing Metal- and Metal alloy-based MEMS structures in a sealed cavity\" (US-9630834). https://patentable.app/patents/US-9630834","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9630834","json":"https://patentable.app/api/llm-context/US-9630834","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T18:30:01.438Z"}