{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9633301","patent":{"patent_number":"US-9633301","title":"IC module, dual IC card, and method for manufacturing IC module","assignee":null,"inventors":[],"filing_date":"2015-12-17T00:00:00.000Z","publication_date":"2017-04-25T00:00:00.000Z","cpc_codes":["G06K","G06K","G06K","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"An IC module of the present invention includes: a sheet-like base having a first surface and a second surface and having a first through hole and a second through hole spaced apart from the first through hole; an IC chip provided to the first surface, having a contact communication function and a contactless communication function, and having two terminals formed thereon; a connecting coil formed on the first surface and having two ends; a contact terminal portion provided to the second surface and configured to contact an external contact machine; bridge wiring provided to the second surface, provided at a position overlapping with the first and second through holes, and electrically insulated from the contact terminal portion; a first conductive wire inserted through the first through hole and connecting the first terminal of the IC chip to the bridge wiring; a second conductive wire inserted through the second through hole and connecting the bridge wiring to the first end of the connecting coil; and a third conductive wire connecting the second end of the connecting coil to the second terminal of the IC chip."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"IC module, dual IC card, and method for manufacturing IC module","description":"An IC module of the present invention includes: a sheet-like base having a first surface and a second surface and having a first through hole and a second through hole spaced apart from the first thro","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9633301","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9633301","citation_suggestion":"Patentable. \"IC module, dual IC card, and method for manufacturing IC module\" (US-9633301). https://patentable.app/patents/US-9633301","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9633301","json":"https://patentable.app/api/llm-context/US-9633301","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:16:43.140Z"}