{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9633874","patent":{"patent_number":"US-9633874","title":"Package substrate warpage reshaping apparatus and method","assignee":null,"inventors":[],"filing_date":"2014-07-17T00:00:00.000Z","publication_date":"2017-04-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A warpage reshaping apparatus to reshape a warpage profile of a package substrate is disclosed. The warpage reshaping apparatus includes a metal boat, a plurality of planar boards and a plurality of spring-loaded clips. The metal boat includes a plurality of cavities. Package substrates are placed into each of the cavities. Each of the plurality of planar boards is disposed on a respective one of the package substrates. The spring-loaded clips have a first portion coupled to the metal boat and having a second portion biased against a respective one of the planar boards such that each planar board is biased against its respective package substrate. In addition to that, a method to operate the warpage reshaping apparatus is also disclosed and the manner in which the warpage reshaping apparatus changes the warpage profile of the package substrate is also disclosed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package substrate warpage reshaping apparatus and method","description":"A warpage reshaping apparatus to reshape a warpage profile of a package substrate is disclosed. The warpage reshaping apparatus includes a metal boat, a plurality of planar boards and a plurality of s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9633874","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9633874","citation_suggestion":"Patentable. \"Package substrate warpage reshaping apparatus and method\" (US-9633874). https://patentable.app/patents/US-9633874","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9633874","json":"https://patentable.app/api/llm-context/US-9633874","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:20:59.212Z"}