{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9633914","patent":{"patent_number":"US-9633914","title":"Split ball grid array pad for multi-chip modules","assignee":null,"inventors":[],"filing_date":"2015-09-15T00:00:00.000Z","publication_date":"2017-04-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"A multi-chip module and method of fabricating a multi-chip module. The multi-chip module includes: a substrate having a top surface and a bottom surface and containing multiple wiring layers, first pads on the top surface of the substrate and second pads on the bottom surface of the substrate; a first active component attached to a first group of the first pads and a second active component attached to a second group of the first pads; wherein at least one pad of the second pads is a split pad having a first section and a non-contiguous second section separated by a gap, the first section connected by a first wire of the multiple wires to a pad of the first group of first pads and the second section is connected by a second wire of the multiple wires to a pad of the second group of first pads."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Split ball grid array pad for multi-chip modules","description":"A multi-chip module and method of fabricating a multi-chip module. The multi-chip module includes: a substrate having a top surface and a bottom surface and containing multiple wiring layers, first pa","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9633914","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9633914","citation_suggestion":"Patentable. \"Split ball grid array pad for multi-chip modules\" (US-9633914). https://patentable.app/patents/US-9633914","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9633914","json":"https://patentable.app/api/llm-context/US-9633914","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:10:40.282Z"}