{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9633931","patent":{"patent_number":"US-9633931","title":"Chip rotated at an angle mounted on die pad region","assignee":null,"inventors":[],"filing_date":"2016-04-22T00:00:00.000Z","publication_date":"2017-04-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":5,"abstract":"A package includes: a plurality of lead frames configured to extend inwardly from an outer circumferential portion of the package; a die pad region surrounded with the lead frames in a plane view; a semiconductor chip mounted on the die pad region; a plurality of bonding pads disposed on the semiconductor chip; and a plurality of bonding wires configured to connect the lead frames and the bonding pads, respectively, wherein the bonding wires are respectively connected to front end portions of the lead frames by bonding with an angle ranging from 45 to 135 degrees with respect to a trace of front end portions of the lead frames in the plane view."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip rotated at an angle mounted on die pad region","description":"A package includes: a plurality of lead frames configured to extend inwardly from an outer circumferential portion of the package; a die pad region surrounded with the lead frames in a plane view; a s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9633931","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9633931","citation_suggestion":"Patentable. \"Chip rotated at an angle mounted on die pad region\" (US-9633931). https://patentable.app/patents/US-9633931","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9633931","json":"https://patentable.app/api/llm-context/US-9633931","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T16:30:03.859Z"}