{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9633932","patent":{"patent_number":"US-9633932","title":"Lead frame package having discharge hole and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2015-05-26T00:00:00.000Z","publication_date":"2017-04-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An electronic package structure includes a substrate having a plurality of conductive leads. A discharge hole is disposed to extend through the substrate. An electronic chip is electrically connected to the plurality of conductive leads. A case is connected to the substrate and defines a cavity between the substrate and an upper of the case. The discharge hole and the electronic chip are disposed within the cavity, and the discharge hole is open to the outside in the electronic package structure. The discharge hole is configured to discharge air pressure that forms during the assembly process thereby improving the reliability of the electronic package structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Lead frame package having discharge hole and method of manufacturing the same","description":"An electronic package structure includes a substrate having a plurality of conductive leads. A discharge hole is disposed to extend through the substrate. An electronic chip is electrically connected ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9633932","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9633932","citation_suggestion":"Patentable. \"Lead frame package having discharge hole and method of manufacturing the same\" (US-9633932). https://patentable.app/patents/US-9633932","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9633932","json":"https://patentable.app/api/llm-context/US-9633932","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:00:14.498Z"}