{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9633936","patent":{"patent_number":"US-9633936","title":"Semiconductor package","assignee":null,"inventors":[],"filing_date":"2015-12-28T00:00:00.000Z","publication_date":"2017-04-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package is provided. In one configuration, the semiconductor package includes a substrate. First and second conductive traces are disposed on the substrate. A conductive pillar bump is disposed on the second conductive trace, and a first conductive structure is disposed between the second conductive trace and the conductive pillar bump or between the second conductive trace and the substrate. A semiconductor die is disposed over the first conductive trace, wherein the conductive pillar bump connects to the semiconductor die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package","description":"A semiconductor package is provided. In one configuration, the semiconductor package includes a substrate. First and second conductive traces are disposed on the substrate. A conductive pillar bump is","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9633936","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9633936","citation_suggestion":"Patentable. \"Semiconductor package\" (US-9633936). https://patentable.app/patents/US-9633936","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9633936","json":"https://patentable.app/api/llm-context/US-9633936","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:36:11.393Z"}