{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9633949","patent":{"patent_number":"US-9633949","title":"Copper etching integration scheme","assignee":null,"inventors":[],"filing_date":"2016-05-13T00:00:00.000Z","publication_date":"2017-04-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"The present disclosure is directed to an integrated circuit. The integrated circuit has a conductive body disposed over a substrate. The conductive body has tapered sidewalls that cause an upper surface of the conductive body to have a greater width than a lower surface of the conductive body. The integrated circuit also has a projection disposed over the conductive body. The projection has tapered sidewalls that cause a lower surface of the projection to have a greater width than an upper surface of the projection and a smaller width than an upper surface of the conductive body. A dielectric material surrounds the conductive body and the projection."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Copper etching integration scheme","description":"The present disclosure is directed to an integrated circuit. The integrated circuit has a conductive body disposed over a substrate. The conductive body has tapered sidewalls that cause an upper surfa","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9633949","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9633949","citation_suggestion":"Patentable. \"Copper etching integration scheme\" (US-9633949). https://patentable.app/patents/US-9633949","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9633949","json":"https://patentable.app/api/llm-context/US-9633949","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T13:36:55.688Z"}