{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9633960","patent":{"patent_number":"US-9633960","title":"Chip with I/O pads on peripheries and method making the same","assignee":null,"inventors":[],"filing_date":"2015-06-30T00:00:00.000Z","publication_date":"2017-04-25T00:00:00.000Z","cpc_codes":["H01L","G06V","G06V","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":5,"abstract":"A chip with I/O pads on the peripheries and a method making the chip is disclosed. The chip includes: a substrate; at least two metal layers, formed above the substrate, each metal layer forming a specific circuit, wherein two adjacent metal layers are separated by an inter-metal dielectric layer; and a passivation layer, formed on a top side of the chip. By changing the I/O pad from the top of the chip to the peripheries, the extra thickness of the packaged chip caused by wire bonding in the prior arts can be reduced."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip with I/O pads on peripheries and method making the same","description":"A chip with I/O pads on the peripheries and a method making the chip is disclosed. The chip includes: a substrate; at least two metal layers, formed above the substrate, each metal layer forming a spe","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9633960","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9633960","citation_suggestion":"Patentable. \"Chip with I/O pads on peripheries and method making the same\" (US-9633960). https://patentable.app/patents/US-9633960","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9633960","json":"https://patentable.app/api/llm-context/US-9633960","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:07:27.893Z"}