{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9633970","patent":{"patent_number":"US-9633970","title":"IGBT device and method for packaging whole-wafer IGBT chip","assignee":null,"inventors":[],"filing_date":"2014-06-16T00:00:00.000Z","publication_date":"2017-04-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"An IGBT device and a method for packaging a whole-wafer IGBT chip. The IGBT device comprises: an entire wafer IGBT chip, the upper surface thereof comprising a central gate connection zone and a plurality of emitter connection zones surrounding the central gate connection zone, and the lower surface thereof comprising a collecting zone, wherein the emitter connection zones located on the surface of a failure cellular zone of the chip are thinned; a collector washer which is fixed on the lower surface of the chip, and an emitter washer which is fixed on the upper surface of the chip; a collector electrode which is electrically contacted with the collector washer, and an emitter electrode which is electrically contacted with the emitter washer; and a gate leading wire which is connected to the central gate connection zone."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"IGBT device and method for packaging whole-wafer IGBT chip","description":"An IGBT device and a method for packaging a whole-wafer IGBT chip. The IGBT device comprises: an entire wafer IGBT chip, the upper surface thereof comprising a central gate connection zone and a plura","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9633970","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9633970","citation_suggestion":"Patentable. \"IGBT device and method for packaging whole-wafer IGBT chip\" (US-9633970). https://patentable.app/patents/US-9633970","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9633970","json":"https://patentable.app/api/llm-context/US-9633970","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T13:16:48.499Z"}