{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9633983","patent":{"patent_number":"US-9633983","title":"Semiconductor chip stacking assemblies","assignee":null,"inventors":[],"filing_date":"2016-02-09T00:00:00.000Z","publication_date":"2017-04-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"Embodiments of the invention provide semiconductor chip stacking assemblies that provide direct attachment of a first semiconductor device with a second semiconductor device. An assembly comprises a first semiconductor chip that has a first and a second set of electrical interconnect regions disposed on its surface and a second semiconductor chip. The first set of electrical interconnect regions are electrically connected with the electrical interconnect regions of a second semiconductor chip, and the second set of electrical interconnect regions are electrically interconnected with the substrate. Direct electrical connections are for example, silicon photonics device-to-driver or device-to-signal converters, logic-to-memory, memory-to-memory, and logic-to-logic chip interconnections."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor chip stacking assemblies","description":"Embodiments of the invention provide semiconductor chip stacking assemblies that provide direct attachment of a first semiconductor device with a second semiconductor device. An assembly comprises a f","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9633983","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9633983","citation_suggestion":"Patentable. \"Semiconductor chip stacking assemblies\" (US-9633983). https://patentable.app/patents/US-9633983","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9633983","json":"https://patentable.app/api/llm-context/US-9633983","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:23:12.811Z"}