{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9634046","patent":{"patent_number":"US-9634046","title":"Semiconductor packages including electrical insulation features","assignee":null,"inventors":[],"filing_date":"2015-04-14T00:00:00.000Z","publication_date":"2017-04-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"A semiconductor package can include a substrate and a semiconductor chip inside the semiconductor package mounted on the substrate. A first conductive pattern can be on the substrate inside the semiconductor package and can be electrically connected to an input/output of the semiconductor chip. A holder can be on the substrate, where the holder can be configured to provide a recess in which the semiconductor chip is located. An electrically insulating adhesive layer can be configured to electrically insulate the first conductive pattern from an Electric Static Discharge (ESD) source located outside the semiconductor package and configured to adhere the holder to the substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packages including electrical insulation features","description":"A semiconductor package can include a substrate and a semiconductor chip inside the semiconductor package mounted on the substrate. A first conductive pattern can be on the substrate inside the semico","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9634046","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9634046","citation_suggestion":"Patentable. \"Semiconductor packages including electrical insulation features\" (US-9634046). https://patentable.app/patents/US-9634046","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9634046","json":"https://patentable.app/api/llm-context/US-9634046","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:01:58.807Z"}