{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9635756","patent":{"patent_number":"US-9635756","title":"Circuit board incorporating semiconductor IC and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2013-09-19T00:00:00.000Z","publication_date":"2017-04-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Disclosed herein is a manufacturing method of a circuit board. The manufacturing method includes a first step for preparing a prepreg in which a core material is impregnated with an uncured resin. The prepreg has a through-hole surrounded by the core material and the resin so as to penetrate through the core material and the resin. The manufacturing method further includes a second step for housing a semiconductor IC in the through-hole, and a third step for pressing the prepreg so that a part of the resin flows into the through-hole to allow the semiconductor IC housed in the through-hole to be embedded in the resin."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Circuit board incorporating semiconductor IC and manufacturing method thereof","description":"Disclosed herein is a manufacturing method of a circuit board. The manufacturing method includes a first step for preparing a prepreg in which a core material is impregnated with an uncured resin. The","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9635756","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9635756","citation_suggestion":"Patentable. \"Circuit board incorporating semiconductor IC and manufacturing method thereof\" (US-9635756). https://patentable.app/patents/US-9635756","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9635756","json":"https://patentable.app/api/llm-context/US-9635756","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:00:22.449Z"}