{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9640420","patent":{"patent_number":"US-9640420","title":"Wafer processing method","assignee":null,"inventors":[],"filing_date":"2016-06-10T00:00:00.000Z","publication_date":"2017-05-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":3,"abstract":"A method of processing a wafer includes coating the front side of the wafer with a water-soluble liquid resin to form a thin film; fixing the wafer to a protective plate for protecting the front side of the wafer, with a bond material interposed between the protective plate and the thin film; holding by a chuck table the protective plate with the wafer fixed thereto and grinding the back side of the wafer to make the wafer have a predetermined thickness; releasing step of releasing the bond material together with the protective plate to which the wafer has been fixed; and supplying water to the bond material remaining on the front side of the wafer to remove the thin film together with the bond material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer processing method","description":"A method of processing a wafer includes coating the front side of the wafer with a water-soluble liquid resin to form a thin film; fixing the wafer to a protective plate for protecting the front side ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9640420","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9640420","citation_suggestion":"Patentable. \"Wafer processing method\" (US-9640420). https://patentable.app/patents/US-9640420","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9640420","json":"https://patentable.app/api/llm-context/US-9640420","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:07:00.251Z"}