{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9640451","patent":{"patent_number":"US-9640451","title":"Wafer bonding structures and wafer processing methods","assignee":null,"inventors":[],"filing_date":"2015-01-15T00:00:00.000Z","publication_date":"2017-05-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A wafer processing method is provided. The method includes providing a to-be-processed wafer having a first surface with a plurality of the device regions and dicing groove regions between adjacent device regions and a second surface; and providing a capping wafer having a first surface and a second surface. The method also includes bonding the first surface of the capping wafer with the first surface of the to-be-processed wafer. Further, the method includes performing an edge trimming process onto the to-be-processed wafer to cause a radius of the to-be-processed wafer to be smaller than a radius of the capping wafer; and grinding the second surface of the capping wafer. Further, the method also includes cleaning the second surface of the capping wafer; and etching a portion of the grinded and cleaned capping wafer to expose the dicing groove regions on the first surface of the to-be-processed wafer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer bonding structures and wafer processing methods","description":"A wafer processing method is provided. The method includes providing a to-be-processed wafer having a first surface with a plurality of the device regions and dicing groove regions between adjacent de","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9640451","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9640451","citation_suggestion":"Patentable. \"Wafer bonding structures and wafer processing methods\" (US-9640451). https://patentable.app/patents/US-9640451","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9640451","json":"https://patentable.app/api/llm-context/US-9640451","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:15:36.966Z"}