{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9640457","patent":{"patent_number":"US-9640457","title":"Power amplifier package and method thereof","assignee":null,"inventors":[],"filing_date":"2015-01-20T00:00:00.000Z","publication_date":"2017-05-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A device is provided, which includes a wiring structure including a first surface and a second surface opposite the first surface. The device also includes a first semiconductor die on the first surface of the wiring structure where the first semiconductor die includes first power amplifier unit. The device further includes a second semiconductor die on the first surface of the wiring structure where the second semiconductor has a second power amplifier unit and is spaced apart from the first semiconductor die. In addition, the device includes a first input port at the second surface of the wiring structure, and a first conductor in the wiring structure to electrically connect the first input port to the first semiconductor die and the second semiconductor die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Power amplifier package and method thereof","description":"A device is provided, which includes a wiring structure including a first surface and a second surface opposite the first surface. The device also includes a first semiconductor die on the first surfa","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9640457","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9640457","citation_suggestion":"Patentable. \"Power amplifier package and method thereof\" (US-9640457). https://patentable.app/patents/US-9640457","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9640457","json":"https://patentable.app/api/llm-context/US-9640457","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:22:10.158Z"}