{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9640460","patent":{"patent_number":"US-9640460","title":"Semiconductor device with a heat-dissipating plate","assignee":null,"inventors":[],"filing_date":"2014-02-03T00:00:00.000Z","publication_date":"2017-05-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A semiconductor device of the present invention includes: a first substrate (1) on which a power semiconductor element (2) is mounted; a heat-dissipating plate (12); an insulating layer (11) disposed between the first substrate (1) and the heat-dissipating plate (12); and molding resin (4) that molds the first substrate (1), the heat-dissipating plate (12), and the insulating layer (11). The heat-dissipating plate (12) has a first surface opposite to the insulating layer (12), the first surface being exposed from the molding resin (4). The insulating layer (11) has a curved area (11a) that is curved to the first surface and an end that is located in the molding resin (4)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device with a heat-dissipating plate","description":"A semiconductor device of the present invention includes: a first substrate (1) on which a power semiconductor element (2) is mounted; a heat-dissipating plate (12); an insulating layer (11) disposed ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9640460","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9640460","citation_suggestion":"Patentable. \"Semiconductor device with a heat-dissipating plate\" (US-9640460). https://patentable.app/patents/US-9640460","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9640460","json":"https://patentable.app/api/llm-context/US-9640460","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:59:28.382Z"}