{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9640473","patent":{"patent_number":"US-9640473","title":"Semiconductor packages","assignee":null,"inventors":[],"filing_date":"2015-07-28T00:00:00.000Z","publication_date":"2017-05-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"Semiconductor packages are provided. A semiconductor package may include an embedding substrate including a cavity therein and a connection window in a bottom portion of the cavity. The semiconductor package may include a semiconductor chip disposed in the cavity and coupled to chip connectors, the chip connectors of the semiconductor chip inserted into the connection window. The semiconductor package may include a dielectric layer filling the cavity and the connection window and configured to expose end portions of the chip connectors and to substantially cover the semiconductor chip. Related memory cards and related electronic systems are also provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packages","description":"Semiconductor packages are provided. A semiconductor package may include an embedding substrate including a cavity therein and a connection window in a bottom portion of the cavity. The semiconductor ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9640473","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9640473","citation_suggestion":"Patentable. \"Semiconductor packages\" (US-9640473). https://patentable.app/patents/US-9640473","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9640473","json":"https://patentable.app/api/llm-context/US-9640473","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:23:36.473Z"}