{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9640475","patent":{"patent_number":"US-9640475","title":"Chip packaging structure and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2016-03-10T00:00:00.000Z","publication_date":"2017-05-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":24,"abstract":"A chip packaging structure includes a chip, a passive component, and at least two metal lines. In the chip, first bonding pads, second bonding pads and connecting pads are disposed above an integrated circuit, and the second bonding pads and the connecting pads are separated from the integrated circuit. The second bonding pads are electrically connected to the corresponding connecting pads, respectively. The passive component is disposed on the chip, and includes two electrodes that are respectively electrically connected to and adhered to one of the corresponding connecting pad. The metal lines are disposed on the chip, and have one end thereof respectively connected to the second bonding pads, and the other end respectively connected to the first bonding pads."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip packaging structure and manufacturing method thereof","description":"A chip packaging structure includes a chip, a passive component, and at least two metal lines. In the chip, first bonding pads, second bonding pads and connecting pads are disposed above an integrated","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9640475","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9640475","citation_suggestion":"Patentable. \"Chip packaging structure and manufacturing method thereof\" (US-9640475). https://patentable.app/patents/US-9640475","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9640475","json":"https://patentable.app/api/llm-context/US-9640475","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:39:20.428Z"}