{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9640491","patent":{"patent_number":"US-9640491","title":"Semiconductor device having semiconductor elements connected to an intermediate plate by a brazing filler metal, and manufacturing method for semiconductor device","assignee":null,"inventors":[],"filing_date":"2014-09-04T00:00:00.000Z","publication_date":"2017-05-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"A semiconductor device, including: an intermediate plate; a semiconductor element connected to one of surfaces of the intermediate plate by a brazing filler metal; a main plate connected to the other one of the surfaces of the intermediate plate by a brazing filler metal; and a resin layer, the intermediate plate having an external region extending to an outer side with respect to a region in which the intermediate plate is connected to the brazing filler metal, a first through-hole extending through the intermediate plate in the external region, the resin layer covering at least the brazing filler metal, the intermediate plate and a surface of the main plate in which the main plate faces the intermediate plate, the resin layer being also arranged inside the first through-hole."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device having semiconductor elements connected to an intermediate plate by a brazing filler metal, and manufacturing method for semiconductor device","description":"A semiconductor device, including: an intermediate plate; a semiconductor element connected to one of surfaces of the intermediate plate by a brazing filler metal; a main plate connected to the other ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9640491","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9640491","citation_suggestion":"Patentable. \"Semiconductor device having semiconductor elements connected to an intermediate plate by a brazing filler metal, and manufacturing method for semiconductor device\" (US-9640491). https://patentable.app/patents/US-9640491","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9640491","json":"https://patentable.app/api/llm-context/US-9640491","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:17:58.445Z"}