{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9640494","patent":{"patent_number":"US-9640494","title":"Grounded die seal integrated circuit structure for RF circuits","assignee":null,"inventors":[],"filing_date":"2016-04-21T00:00:00.000Z","publication_date":"2017-05-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"An integrated circuit (IC) structure for radio frequency circuits having a grounded die seal that mitigates the effects of parasitic coupling through the die seal. Embodiments include conductive grounding ties that each electrically couple one or more of the internal grounding pads on an IC die within the magnetic loop formed by the die seal ring to an adjacent extent of an IC die seal. Induced parasitic energy within the die seal ring is quickly coupled to ground through the corresponding grounding ties and grounding pads. Accordingly, very little, if any, induced parasitic energy is propagated around the die seal ring."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Grounded die seal integrated circuit structure for RF circuits","description":"An integrated circuit (IC) structure for radio frequency circuits having a grounded die seal that mitigates the effects of parasitic coupling through the die seal. Embodiments include conductive groun","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9640494","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9640494","citation_suggestion":"Patentable. \"Grounded die seal integrated circuit structure for RF circuits\" (US-9640494). https://patentable.app/patents/US-9640494","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9640494","json":"https://patentable.app/api/llm-context/US-9640494","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T13:16:38.087Z"}