{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9640499","patent":{"patent_number":"US-9640499","title":"Semiconductor chip, flip chip package and wafer level package including the same","assignee":null,"inventors":[],"filing_date":"2016-02-17T00:00:00.000Z","publication_date":"2017-05-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A semiconductor chip may include a semiconductor substrate, a first central pad, a second central pad, a first peripheral pad, a second peripheral pad, a first pad line and a second pad line. The semiconductor substrate may have an active face. The first central pad and the second central pad may be arranged on a central region of the active face. The first peripheral pad and the second peripheral pad may be arranged on an edge region of the active face. The first pad line may be connected between the first central pad and the first peripheral pad. The second pad line may be connected between the second central pad and the second peripheral pad."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor chip, flip chip package and wafer level package including the same","description":"A semiconductor chip may include a semiconductor substrate, a first central pad, a second central pad, a first peripheral pad, a second peripheral pad, a first pad line and a second pad line. The semi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9640499","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9640499","citation_suggestion":"Patentable. \"Semiconductor chip, flip chip package and wafer level package including the same\" (US-9640499). https://patentable.app/patents/US-9640499","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9640499","json":"https://patentable.app/api/llm-context/US-9640499","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T14:38:34.674Z"}