{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9640574","patent":{"patent_number":"US-9640574","title":"Image sensor circuit, system, and method","assignee":null,"inventors":[],"filing_date":"2011-02-17T00:00:00.000Z","publication_date":"2017-05-02T00:00:00.000Z","cpc_codes":["H04N","H04N","H01L","H01L"],"num_claims":4,"abstract":"A process of forming optical sensors includes sealing an imaging portion of each of a plurality of optical sensors on a sensor wafer with a transparent material. The operation of sealing leaves a bonding portion of each of the optical sensors exposed. The process further includes cutting the wafer into a plurality of image sensor dies after sealing the optical sensors such that each image sensor die includes one of the optical sensors sealed with a corresponding portion of the transparent material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Image sensor circuit, system, and method","description":"A process of forming optical sensors includes sealing an imaging portion of each of a plurality of optical sensors on a sensor wafer with a transparent material. The operation of sealing leaves a bond","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9640574","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9640574","citation_suggestion":"Patentable. \"Image sensor circuit, system, and method\" (US-9640574). https://patentable.app/patents/US-9640574","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9640574","json":"https://patentable.app/api/llm-context/US-9640574","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:51:36.682Z"}