{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9640580","patent":{"patent_number":"US-9640580","title":"Image sensor packages and methods of fabricating the same","assignee":null,"inventors":[],"filing_date":"2015-06-30T00:00:00.000Z","publication_date":"2017-05-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"An image sensor package includes a die having an active side surface and a backside surface opposite to each other and having a bonding pad disposed on the active side surface, a through via penetrating the die and being electrically connected to the bonding pad, and a first dielectric layer disposed between the through via and the die. The first dielectric layer extends to cover the backside surface of the die. A redistribution line is disposed on the first dielectric layer and is electrically connected to the through via. The redistribution line extends onto the first dielectric layer on the backside surface of the die. A second dielectric layer is disposed on the first dielectric layer to cover the redistribution line and to extend onto an outer sidewall of the die. Related methods are also provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Image sensor packages and methods of fabricating the same","description":"An image sensor package includes a die having an active side surface and a backside surface opposite to each other and having a bonding pad disposed on the active side surface, a through via penetrati","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9640580","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9640580","citation_suggestion":"Patentable. \"Image sensor packages and methods of fabricating the same\" (US-9640580). https://patentable.app/patents/US-9640580","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9640580","json":"https://patentable.app/api/llm-context/US-9640580","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:18:15.895Z"}