{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9646865","patent":{"patent_number":"US-9646865","title":"Interconnection structure, fabricating method thereof, and exposure alignment system","assignee":null,"inventors":[],"filing_date":"2016-10-26T00:00:00.000Z","publication_date":"2017-05-09T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"In some embodiments, an interconnection structure, an exposure alignment system, and a fabricating method thereof are provided. The method comprises: providing a wafer, forming a first to-be-connected member and multiple first alignment members in a first conductive layer; form a first opening and multiple second alignment members in a first mask layer, the first opening is used to define a position of a second to-be-connected member; based on reference and measurement coordinates of the first alignment members, and reference coordinates and measurement coordinates of the second alignment members, obtaining wafer coordinates for characterizing a position deviation of the wafer; obtaining adjustment compensation values according to stacking offsets of a preceding wafer; adjusting a position of the wafer; forming the interconnection structure in a first dielectric layer and a second dielectric layer to electrically interconnect the first to-be-connected member and the second to-be-connected member."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interconnection structure, fabricating method thereof, and exposure alignment system","description":"In some embodiments, an interconnection structure, an exposure alignment system, and a fabricating method thereof are provided. The method comprises: providing a wafer, forming a first to-be-connected","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9646865","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9646865","citation_suggestion":"Patentable. \"Interconnection structure, fabricating method thereof, and exposure alignment system\" (US-9646865). https://patentable.app/patents/US-9646865","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9646865","json":"https://patentable.app/api/llm-context/US-9646865","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:02:54.212Z"}