{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9646921","patent":{"patent_number":"US-9646921","title":"Semiconductor package and fabrication method thereof","assignee":null,"inventors":[],"filing_date":"2014-04-17T00:00:00.000Z","publication_date":"2017-05-09T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"A semiconductor package is provided, which includes: a packaging substrate having opposite first and second surfaces and a plurality of first and second conductive pads formed on the first surface; a chip having opposite active and inactive surfaces and disposed on the first conductive pads via the active surface thereof; a plurality of conductive posts formed on the second conductive pads, respectively; and a first encapsulant formed on the first surface of the packaging substrate for encapsulating the chip and the conductive posts and having a plurality of openings for exposing upper surfaces of the conductive posts, thereby increasing the package density and protecting the chip and the interconnection structure from being adversely affected by intrusion of moisture."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and fabrication method thereof","description":"A semiconductor package is provided, which includes: a packaging substrate having opposite first and second surfaces and a plurality of first and second conductive pads formed on the first surface; a ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9646921","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9646921","citation_suggestion":"Patentable. \"Semiconductor package and fabrication method thereof\" (US-9646921). https://patentable.app/patents/US-9646921","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9646921","json":"https://patentable.app/api/llm-context/US-9646921","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:43:41.126Z"}