{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9646922","patent":{"patent_number":"US-9646922","title":"Methods and apparatus for thinner package on package structures","assignee":null,"inventors":[],"filing_date":"2015-05-04T00:00:00.000Z","publication_date":"2017-05-09T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Methods and apparatus for thinner package on package (“PoP”) structures. A structure includes a first integrated circuit package including at least one integrated circuit device mounted on a first substrate and a plurality of package on package connectors extending from a bottom surface; and a second integrated circuit package including at least another integrated circuit device mounted on a second substrate and a plurality of lands on an upper surface coupled to the plurality of package on package connectors, and a plurality of external connectors extending from a bottom surface; wherein at least the second substrate is formed of a plurality of layers of laminated dielectric and conductors. In another embodiment a cavity is formed on the bottom surface of the first substrate and a portion of the another integrated circuit extends partially into the cavity. Methods for making the PoP structures are disclosed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Methods and apparatus for thinner package on package structures","description":"Methods and apparatus for thinner package on package (“PoP”) structures. A structure includes a first integrated circuit package including at least one integrated circuit device mounted on a first sub","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9646922","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9646922","citation_suggestion":"Patentable. \"Methods and apparatus for thinner package on package structures\" (US-9646922). https://patentable.app/patents/US-9646922","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9646922","json":"https://patentable.app/api/llm-context/US-9646922","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:19:00.150Z"}