{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9646925","patent":{"patent_number":"US-9646925","title":"Interconnect array pattern with a 3:1 signal-to-ground ratio","assignee":null,"inventors":[],"filing_date":"2015-08-12T00:00:00.000Z","publication_date":"2017-05-09T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H04B","H04B","H01L"],"num_claims":9,"abstract":"An electronic device including a plurality of interconnects are orthogonally arranged in a grid pattern and evenly spaced by a first distance, the plurality of interconnects include: a first conductor pair with conductors arranged next to each other in a first direction, the first direction is oriented diagonally relative to the orthogonal grid pattern, a second conductor pair with conductors arranged next to each other in a second direction substantially perpendicular to the first direction, each conductor of the second conductor pair is spaced by the first distance from each signal conductor of the first conductor pair, and a third conductor pair with conductors arranged next to each other in a third direction substantially parallel to the first direction, each conductors of the third conductor pair is spaced by the first distance from one of the signal elements of the second conductor pair."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interconnect array pattern with a 3:1 signal-to-ground ratio","description":"An electronic device including a plurality of interconnects are orthogonally arranged in a grid pattern and evenly spaced by a first distance, the plurality of interconnects include: a first conductor","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9646925","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9646925","citation_suggestion":"Patentable. \"Interconnect array pattern with a 3:1 signal-to-ground ratio\" (US-9646925). https://patentable.app/patents/US-9646925","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9646925","json":"https://patentable.app/api/llm-context/US-9646925","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:27:44.422Z"}