{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9646941","patent":{"patent_number":"US-9646941","title":"Semiconductor packaging device including via-in pad (VIP) and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2013-11-11T00:00:00.000Z","publication_date":"2017-05-09T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor device includes a carrier and a metallic structure including a metallic member, a pad and a via portion; wherein the metallic member is disposed inside the carrier, the pad is configured for receiving a solder bump and is disposed on a surface of the carrier, the via portion is configured for electrically connecting the metallic member and the pad, and the via portion is disposed proximal to an end of the pad. Further, a method of manufacturing a semiconductor device includes providing a carrier, removing a portion of the carrier for forming a via extending a surface of the carrier to an interior of the carrier, filling the via by a conductive material, and disposing the conductive material on the surface of the carrier, wherein the via is disposed proximal to an end portion of the conductive material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packaging device including via-in pad (VIP) and manufacturing method thereof","description":"A semiconductor device includes a carrier and a metallic structure including a metallic member, a pad and a via portion; wherein the metallic member is disposed inside the carrier, the pad is configur","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9646941","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9646941","citation_suggestion":"Patentable. \"Semiconductor packaging device including via-in pad (VIP) and manufacturing method thereof\" (US-9646941). https://patentable.app/patents/US-9646941","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9646941","json":"https://patentable.app/api/llm-context/US-9646941","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:05:26.043Z"}