{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9646948","patent":{"patent_number":"US-9646948","title":"Electronic component and method for manufacturing electronic component","assignee":null,"inventors":[],"filing_date":"2016-04-05T00:00:00.000Z","publication_date":"2017-05-09T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"An electronic component comprises: a resin frame; a semiconductor substrate housed in the resin frame; a plate shape metal member having at least one end fixed in the resin frame at a position spaced apart from the semiconductor substrate; an electrical connection region portion formed on the surface on the side of the plate shape metal member of the semiconductor substrate with an electrically conductive material; and a solder layer formed on the surface on the side of the plate shape metal member of the electrical connection region portion, wherein the plate shape metal member supports the semiconductor substrate without contact through the solder layer and the electrical connection region portion, and is electrically connected to the electrical connection region portion."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic component and method for manufacturing electronic component","description":"An electronic component comprises: a resin frame; a semiconductor substrate housed in the resin frame; a plate shape metal member having at least one end fixed in the resin frame at a position spaced ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9646948","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9646948","citation_suggestion":"Patentable. \"Electronic component and method for manufacturing electronic component\" (US-9646948). https://patentable.app/patents/US-9646948","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9646948","json":"https://patentable.app/api/llm-context/US-9646948","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:18:49.311Z"}