{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9647329","patent":{"patent_number":"US-9647329","title":"Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide","assignee":null,"inventors":[],"filing_date":"2014-12-30T00:00:00.000Z","publication_date":"2017-05-09T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"An encapsulated integrated circuit has transceiver circuitry operable to produce and/or receive a radio frequency (RF) signal, wherein bond pads on the IC die are coupled to the transceiver input/output (IO) circuitry. An antenna structure is coupled to the IO circuitry via the bond pads. Mold material encapsulates the IC die and the antenna structure, wherein the antenna structure is positioned so as to be approximately in alignment with a core of a dielectric waveguide positioned adjacent the encapsulated IC."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide","description":"An encapsulated integrated circuit has transceiver circuitry operable to produce and/or receive a radio frequency (RF) signal, wherein bond pads on the IC die are coupled to the transceiver input/outp","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9647329","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9647329","citation_suggestion":"Patentable. \"Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide\" (US-9647329). https://patentable.app/patents/US-9647329","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9647329","json":"https://patentable.app/api/llm-context/US-9647329","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T16:54:06.289Z"}